AMCC (AMCC)

Delivers comprehensive system solutions for communications infrastructure and enterprise storage networking, offering reduced development costs for OEMs and improved reliability for end users.

USVP Contact:

Bill Bowes

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Active-Semi

Power management integrated circuits.

USVP Contact:

Winston Fu

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Agility

Offers breakthrough optical networking infrastructure solutions that dramatically reduce the cost and complexity of telecommunications networks.

USVP Contact:

Steve Krausz and Paul Matteucci

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Akros Silicon

Provides integrated circuits for Power-over-Ethernet applications.

USVP Contact:

Chris Rust

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Alchemy

Alchemy (acquired by AMD) is a communications IC company, targeting wireless and wire-line applications in Internet edge devices.

USVP Contact:

Winston Fu

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Arradiance

Developing a maskless, massively parallel, direct-write e-beam source for semiconductor lithography and metrology.

USVP Contact:

Winston Fu and Arati Prabhakar

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Artisan Components

ARM's Artisan standard cell libraries offer a wide range of performance and density choices, each with a complete set of views and models for leading EDA tools.

USVP Contact:

USVP

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Astute Networks

Provides innovative storage processor IC's which significantly enhance storage systems' performance.

USVP Contact:

Irwin Federman

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Axiom Microdevices

First company to use commodity complementary metal oxide semiconductor (CMOS) processes to produce fully integrated power amplifiers for the cellular telephone market.

USVP Contact:

David Liddle

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Brion Technologies

Brion Technologies (acquired by ASML) is a leader in lithography-driven design and manufacturing.

USVP Contact:

Winston Fu

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Centillium Communications (CTLM)

One of the leading providers of ASDL and Voice-Over-IP ICs.

USVP Contact:

Irwin Federman

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Ciranova

Productivity tool for the design (layout) of analog integrated circuits.

USVP Contact:

Winston Fu

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Clear Shape Technologies

Applying its sub-100nm process technologies to renew the contract between design teams and manufacturing groups, helping to ensure that designers meet their goals with manufacturable designs.

USVP Contact:

Winston Fu

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Dune Networks

Fabless semiconductor supplier of networking devices for Data Center, Enterprise and Carrier Ethernet switching platforms

USVP Contact:

Chris Rust

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Elantec

Elantec (acquired by Intersil) develops high-performance analog integrated circuits.

USVP Contact:

Steve Krausz

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Forte Design Systems

Innovative behavioral synthesis technology that enables designers to use a higher level of design abstraction to create complex electronic devices.

USVP Contact:

Winston Fu

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Genus (GGNS)

Provides equipment for high temperature metal deposition IC fabrication.

USVP Contact:

USVP

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Headway Technologies

Develops, manufactures and supplies magnetoresistive (mr) heads to the disk drive industry.

USVP Contact:

Irwin Federman

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IC Works

IC Works was a leading supplier of frequency generator ICs, and was acquired by Cypress Semiconductor, just prior to it's intended Initial Public Offering.

USVP Contact:

Irwin Federman

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Intermolecular

Developing critical new methods and materials to address the requirements of deep sub-micron semiconductor manufacturing.

USVP Contact:

Irwin Federman and Rick Lewis

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Kilopass Technology

Nonvolatile memory IP.

USVP Contact:

Arati Prabhakar

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Kleer

Kleer (formerly ENQ Semiconductor) develops ultra low-power RF solutions for wireless digital audio.

USVP Contact:

Arati Prabhakar

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LIGHTCONNECT

Designs and manufactures MEMS (micro electro-mechanical systems) components for next-generation, dynamically configurable optical networks.

USVP Contact:

Winston Fu

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Lightspeed Logic

Mask-reconfigurable IP

USVP Contact:

Arati Prabhakar

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LV Sensors

Early-stage MEMs sensor company.

USVP Contact:

Irwin Federman and Paul Matteucci

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Leadis Technology (LDIS)

Designs, develops and markets mixed-signal semiconductors that enable and enhance the features and capabilities of small panel displays.

USVP Contact:

Arati Prabhakar

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MMC Networks

MMC (subsidiary of AMCC) invented the Network Processor IC, and defined that market space. After going public, it was acquired by AMCC, where its CEO became President and Chief Operating Officer.

USVP Contact:

Irwin Federman

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MaxLinear

Fabless communications IC company.

USVP Contact:

David Liddle and Winston Fu

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Mellanox Technologies

Leading supplier of Infiniband, high-performance connectivity IC's.

USVP Contact:

Irwin Federman

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Micro Linear

Micro Linear (acquired by RFMD) is a fabless semiconductor company specializing in wireless integrated circuits. Its high data rate ISM-band transceivers are used in cordless phones, wireless speakers and headphones, game controllers, voice headsets and other consumer electronic appliances.

USVP Contact:

Steve Krausz

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NeoMagic

NeoMagic created a breakthrough by embedding RAM in a logic chip fabricated on a standard process and became the leading supplier of graphics accelerators to the laptop market.

USVP Contact:

Irwin Federman

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Neoconix

Provides advanced electrical interconnect solutions for a variety of applications including assembly sockets, flex connectors, board-to-board connectors, package-to-board interposers, and embedded interconnect solutions.

USVP Contact:

Irwin Federman and Winston Fu

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New Focus

New Focus, acquired by Bookham, Inc., following a successful IPO, develops passive and active optical components and test equipment for communications applications.

USVP Contact:

Winston Fu and Steve Krausz

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Optichron

Fabless semiconductor company developing a family of mixed-signal integrated circuits that target communications, scientific and industrial markets. The company's intellectual property is based on an advanced array of signal processing technologies that provide cost, power and performance advantages.

USVP Contact:

David Liddle

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Pivotal Systems

Delivers process control solutions for semiconductor manufacturing.

USVP Contact:

Arati Prabhakar

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Ponte Solutions

Ponte (formerly E-Z-CAD) has developed a unique technology that enables design teams to enhance integrated circuit (IC) yields prior to design tapeout, before committing chips to multi-million-dollar silicon manufacturing runs.

USVP Contact:

Winston Fu

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SiBEAM

Fabless semiconductor company providing high-speed wireless communications technology.

USVP Contact:

Arati Prabhakar

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Sierra Monolithics

Designs and manufactures sophisticated RFICs and Modules for wireless, wireline and military applications. The company's products are found in applications from hand-held GPS units to unmanned aerial vehicles.

USVP Contact:

Irwin Federman

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Silego Technology

Makes high performance frequency generator, DIMM and power management mixed signal ICs.

USVP Contact:

Irwin Federman

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T-RAM

Fabless semiconductor startup, developing a novel SRAM memory process technology that is expected to have the high performance of SRAM with a memory cell size approaching that of DRAM.

USVP Contact:

David Liddle

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Teknovus

Develops and delivers the only proven, fourth-generation EPON chipset with the features and performance to enable fast, easy-to-deploy, low-cost triple-play (voice, data, video) via fiber to the home (FTTH) at 1000 times the bandwidth of DSL.

USVP Contact:

Winston Fu

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Teranetics

Developing complex mixed signal ICs capable of carrying 10Megabit data-rate signals 100 meters over copper wire.

USVP Contact:

Irwin Federman and Arati Prabhakar

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Xponent

Xponent (formerly Lightgate) designs and manufactures Surface Mount Photonic (SMP) chipsets that vastly reduce the complexity of optical components, resulting in smaller, simpler and less costly products.

USVP Contact:

Steve Krausz

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